Updated on 2022-08-19 GMT+08:00

Distributing Skills

Skills oriented to HiSilicon Hi35xx series chips can be used only after being distributed to devices. For a device that runs HiSilicon Hi35xx series chips, a maximum of five skills can be distributed to it due to performance restrictions.

Prerequisites

Distributing a Skill

  1. Log in to the Huawei HiLens console. In the navigation pane, choose Subscribe > Order Management. The Skill Orders tab page is displayed by default.
  2. Select the skill you need and distribute the skill license to a product.
    In the skill information, only the skills whose Chip is not Ascend 310 can be distributed to products.
    1. Select the skill to be distributed and click Distribute in the Operation column.
      Figure 1 Distributing a skill
    2. In the Distribute to Product dialog box, select the product to which the license is to be distributed, select or not select Yes under Automatic Upgrade as required, and click Distribute to Product.

      If you select Automatic Upgrade, the skill in the product will be automatically upgraded to the latest version if a new version is available for the skill.

      Figure 2 Distribute to Thin Product
    3. The skill distribution information is displayed in the dialog box. Confirm that the installation status is successful and click OK.
  3. Download the skill.

    On the Skill Orders tab page, select the skill you want to use and click Download in the Operation column. The browser automatically downloads the SDK package of the skill.

    Figure 3 Download a skill
  4. Deploy the skill. Integrate the SDK package downloaded in 3 to a device.

    The device location where the skill is integrated varies according to the device. For details about the operation guide, contact Huawei technical engineers.