System Plan

Device-cloud interconnect components provide the following two types of software architectures.

Figure 1 Architecture for single module or MCU

Figure 2 Architecture for external MCUs + chips/modules

Device-cloud interconnect components are divided into the following three layers:

• Open API layer: The device-cloud interconnect components provide open APIs for applications. Devices quickly connect OceanConnect, report service data, and process delivered commands by invoking these APIs. In the external MCUs + chips/modules scenario, device-cloud interconnect components also provides the AT instruction adaptation layer for parsing AT instructions.

• Protocol layer: Device-cloud interconnect components integrate protocols, such as LWM2M, CoAP, Datagram Transport Layer Security (DTLS), TLS, and UDP.
• Driver and network adapter layer: This layer facilitates device integration and porting. You can adapt to APIs related to the hardware random number, memory management, logs, data storage, and network sockets based on the API list of the adaptation layer provided by SDK and specific hardware platform.

LiteOS basic kernel provides RTOS features for devices.